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Datasheet / Notice
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Echantillon
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- Capacity
- 160GB
- Flash
- PSLC
- Temp.max.
- 85°C °C
- Temp.min.
- -40°C °C
- Formfactor
- 2280
- Interface
- PCIE3.0X4
- Automotive
- NO
- RoHS Status
- RoHS-conform
- Packaging
- INDIVIDUAL
- Thickness
- 3.5 mm
- Numéro du tarif douanier
- 85235110000
- Pays
- Taiwan
- Délai de livraison standard
- 10 Semaines
Key Features
- MCU-based Power Loss Protection Design with Level 4 (data-in-flight) protection
- Self-Encrypting Drive (SED) with AES 256-bit encryption, TCG Opal 2.0
- Thermal Heatsink Solutions
- End-to-End Data Path Protection
- TRIM function support
ATP’s
M.2 2280 NVMe solid state modules based on the NVMe™ protocol and
leveraging the PCI Express® (PCIe®) Gen3 x4 interface deliver speedy,
reliable, and enduring performance to fulfill the increasing data
storage demands of today’s embedded and industrial applications.
Constructed with 3D triple level cell (TLC) NAND flash, these modules are available in different capacities, ranging from 40 GB to 3.84 TB, to meet diverse data storage needs.
ATP NVMe SSDs with industrial operating temperature rating deliver stable performance even in extreme temperatures ranging from -40°C to 85°C.
Select ATP M.2 2280 NVMe
modules adopt a Customizable Thermal Management Solution. This includes
firmware and hardware options, such as copper foil and fin-type
heatsink, to effectively dissipate heat and ensure optimal levels of
sustained performance.
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