FS650R08A4P2BPSA1
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- V(CE)
- 750 V
- I(C)
- 650 A
- td(on)
- 1300 ns
- td(off)
- 488 ns
- P(tot)
- 175 W
- t(r)
- YES ns
- V(CEsat)
- NO V
- Bodydiode
- SMD
- Mounting
- IGBT-EDT2
- Automotive
- SEE DATAS.
- Package
- HYBDC6I-1
- RoHS Status
- RoHS-conform
- Packaging
- TRAY
- Référence fabricant
- SP001714512
- ECCN
- EAR99
- Numéro du tarif douanier
- 85412900000
- Pays
- Germany
- Annuaire ABC
- A
- Délai de livraison standard
- 41 Semaines
HybridPACK™ DC6i 750V, 650A sixpack automotive qualified IGBT module
The HybridPACK™ DC6i is a very compact six-pack module (750V/650A) optimized for hybrid and electrical vehicles
This power module complements the benchmark EDT2 IGBT generation with Direct Cooled Base Plate with Ribbon Bonds, NTC temperature sensor and PressFIT contact technology for up to 500V DC and 400 Arms capability enabling inverter designs around 100kW power range*.
Summary of Features
Electrical
- Blocking voltage 750V
- Ic nom: 650A
- Tvj op = 150°C
- Short-time extended Operation Temperature Tvj op = 175°C
- EDT2 chip technology optimized in the range of 10kHz switching frequencies
- 2.5kV AC 1min @ 50Hz
Mechanical
- Direct Cooled Base Plate with Ribbon Bonds (WAVE Base Plate)
- Guiding elements for PCB
- Integrated NTC temperature sensor
- RoHS compliant
Benefits
- Very compact design (25% lower size than HybridPack™ Drive) with benchmark current density (direct cooling via Ribbon Bond structure for improved heat dissipation)
- Superior efficiency by EDT2 technology for excellent light load power losses (20% improved compared to IGBT3)
- Highest reliability by short circuit ruggedness and increased blocking voltage
- Easy and fast assembly through PressFIT Contact Technology (solder-less mounting) and guiding elements
- Fully qualified for Automotive (AQG324)
Potential Applications
- Main Inverter
- Hybrid und Battery Electric Vehicles
- Commercial, Construction and Agriculture Vehicles
*Estimated power range. Final result depends on customer design.
Infineon IPOSIM offers the possibility to simulate the product
capabilities for your application requirements.
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