AF160GSAJB-DBBIX

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Description: M.2 160GB N700Pi 2230 Fabricant: ATP Désignation Produit: AF160GSAJB-DBBIX Rutronik No.: DISSSD1802 Unité d'emballage: 1 MOQ: 1 Packaging: INDIVIDUAL

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Paramètres

Capacity: 160GB
Flash: PSLC
Temp.max.: 85°C °C
Temp.min.: -40°C °C
Formfactor: 2230
Interface: PCIE3.0X4
Automotive: NO
RoHS Status: RoHS-conform
Packaging: INDIVIDUAL

ECCN: EAR99
Numéro du tarif douanier: 85235110000
Pays: Taiwan
Annuaire ABC: A
Délai de livraison standard: 10 Semaines

Description

Key Features

MCU-based Power Loss Protection Design with Level 4 (data-in-flight) protection
Self-Encrypting Drive (SED) with AES 256-bit encryption, TCG Opal 2.0
Thermal Heatsink Solutions
End-to-End Data Path Protection
TRIM function support

ATP’s M.2 2280 NVMe solid state modules based on the NVMe™ protocol and leveraging the PCI Express® (PCIe®) Gen3 x4 interface deliver speedy, reliable, and enduring performance to fulfill the increasing data storage demands of today’s embedded and industrial applications.

Constructed with 3D triple level cell (TLC) NAND flash, these modules are available in different capacities, ranging from 40 GB to 3.84 TB, to meet diverse data storage needs.

ATP NVMe SSDs with industrial operating temperature rating deliver stable performance even in extreme temperatures ranging from -40°C to 85°C.

Select ATP M.2 2280 NVMe modules adopt a Customizable Thermal Management Solution. This includes firmware and hardware options, such as copper foil and fin-type heatsink, to effectively dissipate heat and ensure optimal levels of sustained performance.

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