FT7T68ES4APHBPI
L'image affichée est une représentation non contractuelle
Datasheet / Notice
Ajouté à projet
Echantillon
Download the free Library Loader to convert this file for your ECAD Tool
- Capacity
- 8TB
- Technologies
- TLC
- Interface
- PCIE4.0 X4
- Temp.min.
- 0°C
- Formfactor
- E1.S
- Height
- 9.5 mm
- Temp.max.
- 75°C
- RoHS Status
- RoHS-conform
- Packaging
- INDIVIDUAL
- Automotive
- NO
- ECCN
- EAR99
- Numéro du tarif douanier
- 85235110000
- Pays
- Taiwan
- Annuaire ABC
- A
- Délai de livraison standard
- 8 Semaines
Key features:
- PCIe Gen4 x4 interface
- E1.S 9.5 mm symmetric enclosure
- Industrial temperature operable
- Thermal Management Solution
- MCU-based Power Loss Protection Design with Level 4 (data-in-flight) protection
- Hot-pluggable/Hot-swappable
Built with 176-layer NAND and boasting an impressive 5,000+ program/erase (P/E) cycle endurance, ATP's E1.S SSDs are designed for optimal performance leveraging cutting-edge PCIe® interface and NVMe protocol technologies.
Engineered for 1U Edge servers, ATP's E1.S SSDs are designed for vertical placement in small-footprint systems, allowing up to 6 to 12 drives in a 1U chassis. They support hot swapping/hot plugging for easy serviceability and replacement of drives while the system is on.
High cross-temperature reliability translates to low bit errors and better transmission accuracy for higher data integrity.
Housed in a 9.5 mm symmetric enclosure, ATP’s E1.S SSDs are a result of thermal management solutions.The enclosure features customized hardware and sustained performance firmware tuning, making it an ideal solution to meet the demanding requirements of hyperscale architecture.
Vous pouvez commander de manière définitive les articles du panier ou - si vous avez encore des questions - ou adresser celui-ci comme demande sans engagement.
Rutronik24 e-commerce est réservé exclusivement aux organisations et clients Corporates.
