ENW89829A3KF
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Datasheet / Notice
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Echantillon
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- Length
- 9 mm
- Antenna integra
- Y Y/N
- Width
- 9.5 mm
- Firmware
- HCI
- Height
- 1.7 mm
- Operating temp.
- -40 / +85 °C
- Operating Volta
- 1,8-4,8 V
- Class
- 1
- Bluetooth quali
- Y
- Automotive
- NO
- Bluetooth spec.
- V2.1+EDR
- RoHS Status
- RoHS-conform
- Packaging
- REEL
- Weight
- 2 g
- ECCN
- EAR99
- Numéro du tarif douanier
- 85176200000
- Pays
- Slovakia
- Annuaire ABC
- A
- Délai de livraison standard
- 28 Semaines
Panasonic’s new PAN1325 Host Controlled Interface (HCI) Bluetooth RF
module brings Texas Instrument’s seventh generation Bluetooth core
integrated circuit, the CC2560, to an easy to use module format.
Panasonic’s
tiny footprint technology has produced a module of only 85.5mm². The
module is designed to accommodate PCBs pad pitch of 1.3mm and as little
as two layers for easy implementation and manufacturing.
This module
has been designed to be 100% pin compatible with the next generation of
Bluetooth Dual Mode Low Energy devices. This unique design feature
enables designers to seamlessly transition between Bluetooth Classic and
Low Energy modules.
The PAN1325 makes connectivity between mobile devices such as cellular phones and small button cell battery
powered
devices like fitness sensors, watches, healthcare, entertainment and
mobile accessories easily implemented, creating a seamless data chain
from sensors to the web.More than 250m (line of side) with 6dBm Tx power
could be reached with the PAN1325ETU platform.
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